| انځور | د کلی برخه # / جوړوونکی | تفصیل / پی ډی ایف | مقدار / RFQ |
|---|---|---|---|
 |
Aavid, Thermal Division of Boyd Corporation |
63340 EXTRUSION 1.312X17X3. |
198د کمپیوټر سټاک |
 |
Aavid, Thermal Division of Boyd Corporation |
62285 EXTRUSION 1.63X6.75X4. |
587د کمپیوټر سټاک |
 |
Aavid, Thermal Division of Boyd Corporation |
62545 EXTRUSION 2.75X14.75X4. |
247د کمپیوټر سټاک |
 |
Aavid, Thermal Division of Boyd Corporation |
TO-5 PUSH-ON HEATSINK 6.35MM. Heat Sinks Extruded Collar Style Heatsink for TO-5, Radial Fins, Vertical Mounting, 60 n Thermal Resistance, Black Anodized, 6.35mm |
65859د کمپیوټر سټاک |
 |
Aavid, Thermal Division of Boyd Corporation |
62200 EXTRUSION 0.85X3.5X4. |
976د کمپیوټر سټاک |
 |
Aavid, Thermal Division of Boyd Corporation |
HEATSINK TO-220 W/SHURLOCK-CLIP. |
3808د کمپیوټر سټاک |
 |
Aavid, Thermal Division of Boyd Corporation |
61085 EXTRUSION 1.312X5.375X4. |
677د کمپیوټر سټاک |
 |
Aavid, Thermal Division of Boyd Corporation |
62725 EXTRUSION 2.28X9.75X4.62. |
210د کمپیوټر سټاک |
 |
Aavid, Thermal Division of Boyd Corporation |
78065 EXTRUSION 1.1X0.76X4.1. |
976د کمپیوټر سټاک |
 |
Aavid, Thermal Division of Boyd Corporation |
78025 EXTRUSION 1.24X1.54X4.1. |
976د کمپیوټر سټاک |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Board Level Stamped Heatsink for TO-220, TO-220-Single Gauge, Vertical Mounting, 18.03x25.4x12.7mm |
142998د کمپیوټر سټاک |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Slide-On Board Level Cooling Stamped Heatsink for TO-202, Vertical Mounting, 16.8 n Thermal Resistance, Black Anodized, 1.910mm Hole, Solderable Pins |
34453د کمپیوټر سټاک |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Square Basket Style Board Level Heatsink for TO-3, Folded Back Fins, Horizontal Mounting, 6 n Thermal Resistance, Black Anodized, 25.4mm |
39096د کمپیوټر سټاک |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. |
46652د کمپیوټر سټاک |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Diamond Shaped Basket Stamped Heatsink for TO-66, Low-Cost, Horizontal Mounting, 8 n Thermal Resistance, Black Anodized, 31.75mm |
45850د کمپیوټر سټاک |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks High Power Extruded Style Stamped Heatsink for MULTIWATT, Vertical Mounting, 6.8 n Thermal Resistance, Black Anodized, 2.89mm Hole, 25.4mm, Solderable Pins |
33266د کمپیوټر سټاک |
 |
Aavid, Thermal Division of Boyd Corporation |
78075 EXTRUSION 2.13X1.5X4.1. |
948د کمپیوټر سټاک |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Diamond Shaped Basket Stamped Heatsink for TO-3, Space-Saving, Horizontal Mounting, 11 n Thermal Resistance, Black Anodized, 25.4mm |
69263د کمپیوټر سټاک |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. |
72911د کمپیوټر سټاک |
 |
Aavid, Thermal Division of Boyd Corporation |
HEATSINK TO-3 14W H0.82 BLK. Heat Sinks Board Level Heatsink for TO-3, Black Anodized, 63.5x63.5x20.86mm |
32848د کمپیوټر سټاک |
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